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EnSilica (ENSI): German automotive chip supply contract

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ENSI EnSilica

£109m · 75.0p · −34% since the first step
Transformational contract / build-out
German automotive chip supply contract
Contract won; supply revenue from FY27
Every step · 5
  1. 1 Jun 2026 Contract awarded; supply to begin – EnSilica was awarded the Contract after completing a competitive tender process. ↗
  2. 11 Jun 2026 Production tape-out completed; tooling and samples next – The Edge-AI supply contract is expected to become a significant revenue contributor to the Group of up to an estimated US$50 million over five years once... ↗
  3. 23 Jun 2026 Tape-out done; slipped from FY26 into FY27 – On 11 June 2026, shortly after the year end, the Company announced the completion of the tape-out stage for the Edge AI contract, which had originally been... ↗
  4. 5 Oct 2026 Tape-out done; volume production expected 2027 – As part of the above, the Edge AI ASIC completed production tape-out, marking a key development milestone ahead of volume production as well as releasing... ↗
  5. 5 Oct 2026 Contract won; supply revenue from FY27 – Secured a $75 million automotive contract win with a German tier-one supplier, our largest automotive win to date ↗

What is happening

EnSilica: German automotive chip supply contract – Contract won; supply revenue from FY27. ['Contract won; supply revenue from FY27']

In short
On 1 June 2026 EnSilica announced a 7-year manufacturing and supply contract for an Arm-based sensing chip. The 5 Oct 2026 results restate the roughly $75m win as the largest automotive win to date. About $4m of revenue is expected in FY27.
Announced
1 Jun 2026 · Contract awarded; supply to begin
Latest
5 Oct 2026 · Reported as largest automotive win
Customer
German manufacturer of automotive components (unnamed)
Strategic benefits
Tier 1 German supply chain link, more wafer volume, VDA-aligned quality standard
Tape-out
Completed 11 June 2026, after year end
NRE and fee
US$5m, recognised across FY26 and FY27
Supply potential
Up to an estimated US$50m over five years
Next milestone
First silicon samples anticipated in 2026
Volume production
Expected during calendar year 2027
Timetable driver
Progress led by the customer's schedule
Briefing

EnSilica in 4 minutes

EnSilica designs custom chips for satellite, automotive, industrial and photonics customers. It makes no chips itself, and its sites are near Oxford, in the UK, India, Brazil and Hungary. In the year to May 2026 it...

  1. Act 1Growth on contract wins, funded by small raises
  2. Act 2FY25: the forecast missed by a wide margin
  3. Act 3FY26: profit, cash and two fundraisings
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Answered from its own announcements and reported figures, every statement linked to its source.

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Also at EnSilica 2 open
Segment turnSpace communications ASIC pipeline – Follow-on orders closed; development under way Project milestonesFY25 ASIC contract wins tape-outs – Stage 1 under way Dilutive fundraiseEquity fundraise up to £10m – Described as completed; £10m raised · closed Insider conviction2 directors buying – £72k in 2 buys · closed EnSilica – company page →

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