Significant c.US$20 million Supply Win

EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), is pleased to announce that it has secured a significant order for the tape-out of a custom ASIC from a major electronics manufacturer headquartered in the US, worth c.US$20 million in revenue for the calendar years 2025 and 2026 (the "Supply Win"). The tape-out process marks the stage where the design of the ASIC is finalised and sent to the foundry for fabrication.

This Supply Win, which was gained in part through the Company's global engineering and support team, alongside its extensive expertise with digital, analogue and radio frequency ("RF") chips, is the first order from the US for manufacturing-only services utilising EnSilica's new silicon foundry channel partner.

Management believes that the US represents a sizable growth market for the Company and is actively pursuing similar orders which, if secured, could enhance production margins across EnSilica's ASIC business through increased wafer volumes whilst also helping strengthen the Group's position within the semiconductor supply chain.

Ian Lankshear, Chief Executive Officer of EnSilica, commented:

"We are delighted to announce this Supply Win from the US, which reinforces our position as a quality focused supply partner for customers and further strengthens our foundry partnerships in the US.

The US now represents a sizable growth opportunity for the Group, and we believe the award of this contract has the potential to generate further business, thereby bolstering our near-term revenue growth and cash-generation."